General Announcement::Notice to Bondholders for Redemption Completed

Issuer & Securities

Issuer/ Manager
UNITED MICROELECTRONICS CORPORATION
Securities
UNITEDMICROELECUS$400M Z260707 - XS2358241243 - 5YRB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
08-Jul-2026 16:00:56
Status
New
Announcement Sub Title
Notice to Bondholders for Redemption Completed
Announcement Reference
SG260708OTHRZUAG
Submitted By (Co./ Ind. Name)
Chitung Liu
Designation
CFO
Effective Date and Time of the event
08/07/2026 16:00:00
Description (Please provide a detailed description of the event in the box below)
NOTICE IS HEREBY GIVEN that the final redemption of the Bonds was completed on July 7, 2026, the maturity date of the Bonds. The Bonds will be delisted from the SGX-ST.

Pursuant to Article 10 and Condition 8(A) of the Indenture dated as of July 7, 2021 (as amended or supplemented from time to time, the Indenture ) among UMC and Citicorp International Limited, as trustee (the Trustee ), relating to the Bonds, and pursuant to the terms of the Bonds, UMC has redeemed all the outstanding Bonds on July 7, 2026, under the following conditions:

The Final Redemption Amount was US$169,503.69 for each US$200,000 principal amount of Bonds. The aggregate principal amount of the Outstanding Bonds as of July 7, 2026 was US$20,900,000.

All capitalized terms used but not defined herein shall have the meaning ascribed to such term in the Indenture.

Attachments

Redemption Completed_20260708.pdf
Total size =1010K