General Announcement::Debt Issuance Program Offering Circular

Issuer & Securities

Issuer/ Manager
TELSTRA CORPORATION LIMITED
Securities
TELSTRA CORP A$50M6.93%N231219 - XS0719512609 - 7WAB
TELSTRA CORPEUR75M4.01%N231220 - XS0719492224 - 7WBB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
24-Feb-2023 03:44:49
Status
New
Announcement Sub Title
Debt Issuance Program Offering Circular
Announcement Reference
SG230224OTHRCWER
Submitted By (Co./ Ind. Name)
TELSTRA CORPORATION LIMITED
Designation
Office of the Company Secretary
Effective Date and Time of the event
23/02/2023 00:00:00
Description (Please provide a detailed description of the event in the box below)
In accordance with the Listing Rules, I attach a copy of Telstra Group Limited's Debt Issuance Program Offering Circular which was registered with the Singapore Exchange in respect of Telstra Group Limited on 23 February 2023, for release to the market.

The DIP OC is provided for the information of Telstra Corporation Limited noteholders, but does not impact the terms of any debt securities issued by Telstra Corporation Limited.

Attachments

SGX23_006 DIP OC_240223.pdf
Total size =2776K