General Announcement::Temasek offers 1.8% 5-year T2026-S$ Temasek Bond

Issuer & Securities

Issuer/ Manager
TEMASEK FINANCIAL (IV) PRIVATE LIMITED
Securities
TEMASEK S$500M 2.7% B 231025 - SGXF40333795 - TEKB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
15-Nov-2021 19:37:43
Status
New
Announcement Sub Title
Temasek offers 1.8% 5-year T2026-S$ Temasek Bond
Announcement Reference
SG211115OTHRALG0
Submitted By (Co./ Ind. Name)
Chong Hui Min
Designation
Director, Investor Relations
Description (Please provide a detailed description of the event in the box below)
- Second Temasek Bond with Placement and Public Offer tranches
- 1.8% coupon determined through an institutionally-driven bookbuilding process
- Placement of S$250 million to specified investors
- Public Offer of up to S$100 million to retail investors in Singapore
--- Applications via participating ATMs, online and mobile app
--- Public Offer opens Tuesday, 16 November 2021 at 9am
--- Public Offer closes Monday, 22 November 2021 at 12 Noon
--- Applications in multiples of S$1,000 with minimum of S$1,000
- Approval in-principle for listing on the SGX-ST

Attachments

SGX_Launch_of_Offer_Announcement_15Nov2021.pdf
Total size =259K