General Announcement::The upcoming closed period to Bonds

Issuer & Securities

Issuer/ Manager
TAIFLEX SCIENTIFIC CO., LTD.
Securities
TAIFLEX SCI USD70MZ261130 - XS2385251017 - RNEB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
07-Jun-2023 17:45:29
Status
New
Announcement Sub Title
The upcoming closed period to Bonds
Announcement Reference
SG230607OTHR4LIK
Submitted By (Co./ Ind. Name)
TAIFLEX SCIENTIFIC CO., LTD.
Designation
COMPANY
Effective Date and Time of the event
08/06/2023 08:00:00
Description (Please provide a detailed description of the event in the box below)
We refer to the above bond issue and, as required under the Indenture Agreement date 30 November, 2021, we hereby notify you the upcoming closed period of Bond conversion is from 16-June-2023 to 15-July-2023 for 2023 dividend distribution.

Attachments

Taiflex-The upcoming closed period to Bonds conversion-20230608.pdf
Total size =304K