General Announcement::AWARD OF $165 MILLION CONTRACT BY HDB FOR BUILDING WORKS AT SEMBAWANG (THE "CONTRACT")
Issuer & Securities
CHIP ENG SENG CORPORATION LTD.
CHIP ENG SENG CORPORATION LTD - SG1H36875612 - C29
Date &Time of Broadcast
Announcement Sub Title
AWARD OF $165 MILLION CONTRACT BY HDB FOR BUILDING WORKS AT SEMBAWANG (THE "CONTRACT")
Submitted By (Co./ Ind. Name)
Chia Lee Meng Raymond
Executive Deputy Chairman and Chief Executive Officer
Description (Please provide a detailed description of the event in the box below)
The Board of Directors (the "Board") of Chip Eng Seng Corporation Ltd. (the "Company") refers to the Company's earlier announcement dated 2 June 2014.
The Board is pleased to announce that the Contract is not expected to have any material impact on the net tangible assets and earnings per share of the Group for the current financial year ending 31 December 2014.
None of the Directors and, to the best knowledge of the Directors, none of the substantial shareholders or controlling shareholders of the Company, has any direct or indirect interest in the transaction.