Change - Change in Corporate Information::Registered Capital of Hi-P (Shanghai) Precision Mold & Die Co., Ltd.

Issuer

Issuer/ Manager
HI-P INTERNATIONAL LIMITED

Announcement Details

Announcement Title
Change - Change in Corporate Information
Date &Time of Broadcast
28-Jan-2019 17:17:18
Status
New
Announcement Sub Title
Registered Capital of Hi-P (Shanghai) Precision Mold & Die Co., Ltd.
Announcement Reference
SG190128OTHRLRWW
Submitted By (Co./ Ind. Name)
Yao Hsiao Tung
Designation
Executive Chairman and Chief Executive Officer
Description (Please provide a detailed description of the event in the box below)
Please refer to attachment.

Place Of Incorporation

Existing
Singapore
New

Registered Address

Existing
New

Attachments

Hi-P_Registered Capital Hi-P Shanghai Precision.pdf
Total size =56K