General Announcement::Proposed 5-year T2026-S$ Temasek Bond

Issuer & Securities

Issuer/ Manager
TEMASEK FINANCIAL (IV) PRIVATE LIMITED
Securities
TEMASEK S$500M 2.7% B 231025 - SGXF40333795 - TEKB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
15-Nov-2021 09:45:19
Status
New
Announcement Sub Title
Proposed 5-year T2026-S$ Temasek Bond
Announcement Reference
SG211115OTHRHX9B
Submitted By (Co./ Ind. Name)
Chong Hui Min
Designation
Director, Investor Relations
Description (Please provide a detailed description of the event in the box below)
- Proposed offer of up to S$350 million, with potential upsize to a maximum of S$500 million
- Bookbuilding with specified investors commencing shortly for placement tranche
- Public offer tranche to be open to retail investors in Singapore in due course

Attachments

SGX_Bookbuilding_Announcement_15Nov2021.pdf
Total size =127K