General Announcement::ST Engineering announces the issuance of US$500 million 4.125% Notes due 2026

Issuer & Securities

Issuer/ Manager
STE TRANSCORE HOLDINGS, INC.
Securities
STE TRANSUS$700M3.375%N270505A - US85235DAA72 - GXGB
STE TRANSUS$700M3.375%N270505R - USU8585EAA02 - VX5B
STE TRANS US$300M3.75%N320505A - US85235DAB55 - WA2B
STE TRANS US$300M3.75%N320505R - USU8585EAB84 - YU2B
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
16-May-2023 23:09:17
Status
New
Announcement Sub Title
ST Engineering announces the issuance of US$500 million 4.125% Notes due 2026
Announcement Reference
SG230516OTHRODFW
Submitted By (Co./ Ind. Name)
Tan Wan Hoon
Designation
Joint Company Secretary, ST Engineering
Description (Please provide a detailed description of the event in the box below)
Announcement made by Singapore Technologies Engineering Ltd on 16 May 2023 in relation to ST Engineering announces the issuance of US$500 million 4.125% Notes due 2026.

Please see attached for information.

Attachments