Moratorium::Application for leave to convene Shareholders' Scheme Meeting

Issuer & Securities

Issuer/ Manager
HIAP SENG ENGINEERING LTD
Securities
HIAP SENG ENGINEERING LTD - SG1G69871497 - 510
Stapled Security
No

Announcement Details

Announcement Title
Moratorium
Date &Time of Broadcast
17-Oct-2023 18:51:07
Status
New
Announcement Sub Title
Application for leave to convene Shareholders' Scheme Meeting
Announcement Reference
SG231017OTHRJHUJ
Submitted By (Co./ Ind. Name)
Tan Hak Jin
Designation
Joint Company Secretary
Description (Please provide a detailed description of the event in the box below-Refer to the Online help for the format)
Please see the attachment.

Attachments

HSEL_Application_for_leave_to_convene_shareholders_scheme_meeting.pdf
Total size =197K