General Announcement::T2026-S$ Temasek Bond Offer Upsized to S$500 million; Allocation Completed

Issuer & Securities

Issuer/ Manager
TEMASEK FINANCIAL (IV) PRIVATE LIMITED
Securities
TEMASEK S$350M 1.8% B 261124 - SGXF88630292 - TEMB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
23-Nov-2021 16:24:35
Status
New
Announcement Sub Title
T2026-S$ Temasek Bond Offer Upsized to S$500 million; Allocation Completed
Announcement Reference
SG211123OTHRVU5O
Submitted By (Co./ Ind. Name)
Chong Hui Min
Designation
Director, Investor Relations
Description (Please provide a detailed description of the event in the box below)
2 attachments:
- Announcement: T2026-S$ Temasek Bond Offer Upsized to S$500 million; Allocation Completed
- Final Pricing Supplement

Attachments

SGX_Allocation_Announcement_23Nov2021.pdf
Temasek_Series2_Pricing_Supplement_15Nov2021_with_Issue_Details_Supplement.pdf
Total size =385K