General Announcement::Bond Issue through Funded Here Pte Ltd
Issuer & Securities
Issuer/ Manager
METECH INTERNATIONAL LIMITED
Securities
METECH INTERNATIONAL LIMITED - SG2E79981816 - QG1
METECH INTERNATIONAL LTD - SGXE91187273 - V3M
Stapled Security
No
Announcement Details
Announcement Title
General Announcement
Date &Time of Broadcast
13-Nov-2018 22:44:56
Status
New
Announcement Sub Title
Bond Issue through Funded Here Pte Ltd
Announcement Reference
SG181113OTHRVHUI
Submitted By (Co./ Ind. Name)
Benedict Lim
Designation
EVP
Description (Please provide a detailed description of the event in the box below)
See attachment for details.
Attachments
Bond Issue Through FundedHere.pdf
Total size =64K
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