General Announcement::GVT Chosen as Preferred Supplier For Advanced Semiconductor Packaging (Thermal Compression Bonding)

Issuer & Securities

Issuer/ Manager
GRAND VENTURE TECHNOLOGY LIMITED
Securities
GRAND VENTURE TECHNOLOGY LTD - SGXE82751350 - JLB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
18-Dec-2024 23:04:01
Status
New
Announcement Sub Title
GVT Chosen as Preferred Supplier For Advanced Semiconductor Packaging (Thermal Compression Bonding)
Announcement Reference
SG241218OTHRN0FO
Submitted By (Co./ Ind. Name)
Lee Tiam Nam
Designation
Executive Deputy Chairman
Description (Please provide a detailed description of the event in the box below)
Please refer to the attached Press Release.

Attachments

GVT - Press Release_TCB.pdf
Total size =123K