General Announcement::Chip Eng Seng clinches $165 million HDB contract for building works at Sembawang
Issuer & Securities
CHIP ENG SENG CORPORATION LTD.
CHIP ENG SENG CORPORATION LTD - SG1H36875612 - C29
Date &Time of Broadcast
Announcement Sub Title
Chip Eng Seng clinches $165 million HDB contract for building works at Sembawang
Submitted By (Co./ Ind. Name)
Chia Lee Meng Raymond
Executive Deputy Chairman and Chief Executive Officeras
Description (Please provide a detailed description of the event in the box below)
Please see attached.
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