General Announcement::Chip Eng Seng clinches $165 million HDB contract for building works at Sembawang

Issuer & Securities

Issuer/ Manager
CHIP ENG SENG CORPORATION LTD.
Securities
CHIP ENG SENG CORPORATION LTD - SG1H36875612 - C29

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
02-Jun-2014 17:28:27
Status
New
Announcement Sub Title
Chip Eng Seng clinches $165 million HDB contract for building works at Sembawang
Announcement Reference
SG140602OTHR6TYI
Submitted By (Co./ Ind. Name)
Chia Lee Meng Raymond
Designation
Executive Deputy Chairman and Chief Executive Officeras
Description (Please provide a detailed description of the event in the box below)
Please see attached.

Attachments

CES_HDB Contract_PR.pdf
Total size =123K