General Announcement::Capital Investment for High Performance IC Package Substrates Acquisition of Fixed Assets

Issuer & Securities

Issuer/ Manager
IBIDEN CO., LTD.
Securities
IBIDEN YEN70B Z310314 - XS2774311224 - FAOB
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
26-Feb-2026 15:22:33
Status
New
Announcement Sub Title
Capital Investment for High Performance IC Package Substrates Acquisition of Fixed Assets
Announcement Reference
SG260226OTHRB6Y1
Submitted By (Co./ Ind. Name)
Katsutoshi Nishimura
Designation
Finance Division Manager, Strategic Corporate Planning Operation
Effective Date and Time of the event
26/02/2026 15:40:00
Description (Please provide a detailed description of the event in the box below)
IBIDEN CO., LTD. (hereinafter the Company ) announced that the Board of Directors, at a meeting held February 3, 2026, resolved to approve a capital investment plan for its electronics business, amounting to approximately 500 billion yen over the three-year period from fiscal year 2026 to fiscal year 2028. As the first phase of this plan, the Company announced our resolution to implement additional capital investment, primarily for the existing Gama Plant (Cell6). The Company hereby announces that, as part of the progress in the remaining phases of our investment plan, the Board of Directors, at a meeting held today, resolved to implement additional capital investment, primarily for the Ono Plant (Cell8), for the purpose of expanding the production capacity of high-performance IC package substrates, mainly for high-performance servers.

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