General Announcement::Bond Issue Through Crowdfunding Platform FundedHere Pte Ltd

Issuer & Securities

Issuer/ Manager
METECH INTERNATIONAL LIMITED
Securities
METECH INTERNATIONAL LIMITED - SG2E79981816 - QG1
METECH INTERNATIONAL W171005 - SG43T3000003 - 42MW
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
29-Nov-2016 06:55:13
Status
New
Announcement Sub Title
Bond Issue Through Crowdfunding Platform FundedHere Pte Ltd
Announcement Reference
SG161129OTHR54QA
Submitted By (Co./ Ind. Name)
Benedict Lim
Designation
EVP
Description (Please provide a detailed description of the event in the box below)
Please see attachment.

Attachments

Engagement of FundedHere for Bond Issue.pdf
Total size =48K