REPL::General Announcement::COMPLETION OF THE ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019
Issuer & Securities
Issuer/ Manager
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
Securities
SEMICONDUCTOR US$200M CB181107 - XS0987076899 - 2J6B
Stapled Security
No
Announcement Details
Announcement Title
General Announcement
Date &Time of Broadcast
08-Oct-2014 15:49:59
Status
Replacement
Announcement Sub Title
COMPLETION OF THE ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019
Announcement Reference
SG141008OTHRXQ4Q
Submitted By (Co./ Ind. Name)
MEIFUNG HOO
Designation
JOINT COMPLIANCE OFFICER
Effective Date and Time of the event
07/10/2014 22:00:00
Description (Please provide a detailed description of the event in the box below)
The Company is pleased to announce that completion of the issue of the Bonds in the principal amount of US$500,000,000 took place on 7 October 2014.
Attachments
Closing Announcement_e.pdf
Closing Announcement_c.pdf
Total size =533K
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08/10/2014 15:43:41