REPL::Coupon Payment::Mandatory

Issuer & Securities

Issuer/Manager
ADDVALUE TECHNOLOGIES LTD
Security
ADDVALUE S$5.006340M6%CB271104 - SGXF47366798 - MYLB

Announcement Details

Announcement Title
Coupon Payment
Date &Time of Broadcast
18-Apr-2023 08:25:43
Status
Replacement
Corporate Action Reference
SG230418INTRBEVD
Submitted By (Co./Ind. Name)
TAN KHAI PANG
Designation
CHIEF EXECUTIVE OFFICER
Method of Coupon Computation
Actual/ 365 (Fixed)
Annual Coupon Rate (%)
6
Maturity Date
04/11/2027
Next Coupon Payment Date
04/05/2023

Event Narrative

Narrative Type
Narrative Text
Additional TextAnnouncement in relation to the interest payment for the S$5,006,338 6% in aggregate principal amount of Convertible Bonds due 2027 of Addvalue Technologies Ltd

Event Dates

Coupon Period (both dates inclusive)
04/11/2022 TO 03/05/2023
Number of Days
181
Record Date and Time
19/04/2023 17:00:00
Ex Date
18/04/2023

Disbursement Details

Cash Payment Details
Taxable
No
Coupon Rate (%)
6
Pay Date
04/05/2023
Country of Income
Singapore

Related Announcements

Related Announcements

18/04/2023 08:19:25