General Announcement::PROPOSED ISSUE OF BONDS

Issuer & Securities

Issuer/ Manager
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
Securities
SEMICONDUCTOR US$200M CB181107 - XS0987076899 - 2J6B
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
17-Sep-2014 11:58:31
Status
New
Announcement Sub Title
PROPOSED ISSUE OF BONDS
Announcement Reference
SG140917OTHRSGBJ
Submitted By (Co./ Ind. Name)
Issuer Services
Designation
SGX-ST
Description (Please provide a detailed description of the event in the box below)
The Company proposes to conduct an international offering of the Bonds to professional investors only. The Bonds will only be offered and sold in an institutional offering in the United States in reliance on Rule 144A of the Securities Act and outside the United States in reliance on Regulation S of the Securities Act. Deutsche Bank and J.P. Morgan are the Joint Lead Managers in connection with the issue of the Bonds. Pricing of the Bonds, including the aggregate principal amount, the offer price and the interest rate, will be determined through a book building exercise to be coordinated by the Joint Lead Managers. As at the date of this announcement, the principal amount, the interest and other terms and conditions of the Proposed Bonds Issue have yet to be determined. Upon finalisation of the terms of the Proposed Bonds Issue, the Company and the Joint Lead Managers are expected to enter into a subscription agreement and other ancillary documents in relation to the Proposed Bonds Issue.

Attachments

Corporate Bonds Pre-launch Announcement_e.pdf
Corporate Bonds Pre-launch Announcement_c.pdf
Total size =1103K

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