REPL::Bondholder's Early Redemption (Put Option)::Voluntary

Issuer & Securities

Issuer/ Manager
CHIP ENG SENG CORPORATION LTD.
Security
CHIP ENG SENG CORPORATION LTD - SG1H36875612 - C29

Announcement Details

Announcement Title
Bondholder's Early Redemption (Put Option)
Date &Time of Broadcast
24-Mar-2023 17:59:38
Status
Replacement
Corporate Action Reference
SG230303BPUTFTU3
Submitted By (Co./ Ind. Name)
Chia Lee Meng Raymond
Designation
Executive Director and Group Chief Executive Officer
Original Maturity Date
06/12/2024

Event Narrative

Narrative Type
Narrative Text
Additional TextPlease see attached.

Disbursement Details

Existing Security Details
Cash Payment Details
Redemption Rate (%)
100
Pay Date
10/04/2023

Attachments

CES - Extension Notice_Final.pdf
Total size =117K

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