General Announcement::PROPOSED ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019

Issuer & Securities

Issuer/ Manager
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
Securities
SEMICONDUCTOR US$200M CB181107 - XS0987076899 - 2J6B
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
26-Sep-2014 16:33:13
Status
New
Announcement Sub Title
PROPOSED ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019
Announcement Reference
SG140926OTHRFWGQ
Submitted By (Co./ Ind. Name)
Issuer Services
Designation
SGX-ST
Description (Please provide a detailed description of the event in the box below)
On 25 September 2014, the Company and the Joint Lead Managers entered into the Bond Subscription Agreement, pursuant to which each of the Joint Lead Managers has agreed to subscribe and pay for, or to procure subscribers to subscribe and pay for the Bonds to be issued by the Company in an aggregate principal amount of US$500 million. Completion of the Bond Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent therein and is expected to take place on 7 October 2014. In addition, the Bond Subscription Agreement may be terminated in certain circumstances. The gross proceeds from the issue of the Bonds will be approximately US$494.82 million. The net proceeds (net of fees, commissions and expenses) from the issue of the Bonds will be approximately US$491 million. The Company intends to use the net proceeds (net of fees, commissions and expenses) from the issue of the Bonds for (i) the Company s debt repayment and (ii) capital expenditure in relation to capacity expansion associated with 8-inch and 12-inch manufacturing facilities and general corporate purposes.

Attachments

e_Proposed Issue of US$500M 4.125 Bonds due 2019.pdf
c_Proposed Issue of US$500M 4.125 Bonds due 2019.pdf
Total size =722K

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