Coupon Payment::Mandatory

Issuer & Securities

Issuer/Manager
HOUSING AND DEVELOPMENT BOARD
Security
HDB S$500M2.55%N231120 - SGXF44549545 - RYYB

Announcement Details

Announcement Title
Coupon Payment
Date &Time of Broadcast
28-Apr-2023 10:43:47
Status
New
Corporate Action Reference
SG230428INTRZLXP
Submitted By (Co./Ind. Name)
Tan Siew Bee
Designation
Officer
Method of Coupon Computation
Actual/ Actual (ICMA)
Annual Coupon Rate (%)
2.55
Maturity Date
20/11/2023
Next Coupon Payment Date
22/05/2023

Event Narrative

Narrative Type
Narrative Text
Information to be complied withHOUSING & DEVELOPMENT BOARD S$32 BILLION MULTICURRENCY MEDIUM TERM NOTE PROGRAMME S$500,000,000 2.55% P.A. FIXED RATE NOTES (SERIES NO. 083)
INTEREST FOR PERIOD NOVEMBER 20, 2022 UP TO BUT NOT INCLUDING MAY 20, 2023
(PAYABLE ON MAY 22, 2023)

INTEREST PERIOD = NOVEMBER 20, 2022 UP TO BUT NOT INCLUDING MAY 20, 2023

NO. OF DAYS = 181 DAYS

INTEREST RATE = 2.55% P.A.

CALCULATION OF INTEREST = ACTUAL OVER ACTUAL (ICMA)

INTEREST PAYMENT DATE = MAY 22, 2023

BOOK CLOSURE DATE = MAY 15, 2023 AT 5 P.M

Event Dates

Coupon Period (both dates inclusive)
20/11/2022 TO 19/05/2023
Number of Days
181
Record Date and Time
15/05/2023 17:00:00
Ex Date
12/05/2023

Disbursement Details

Cash Payment Details
Taxable
No
Coupon Rate (%)
2.55
Pay Date
22/05/2023

Attachments

HDB Series 083 - 22May23.pdf
Total size =1553K