Coupon Payment::Mandatory

Issuer & Securities

Issuer/Manager
HOUSING AND DEVELOPMENT BOARD
Security
HDB S$500M2.35%N270525 - SG7CF3000005 - 71RB

Announcement Details

Announcement Title
Coupon Payment
Date &Time of Broadcast
06-Nov-2023 14:11:04
Status
New
Corporate Action Reference
SG231106INTRSLCD
Submitted By (Co./Ind. Name)
Tan Siew Bee
Designation
Officer
Method of Coupon Computation
Actual/ Actual (ICMA)
Annual Coupon Rate (%)
2.35
Maturity Date
25/05/2027
Next Coupon Payment Date
27/11/2023

Event Narrative

Narrative Type
Narrative Text
Information to be complied withHOUSING & DEVELOPMENT BOARD S$32 BILLION MULTICURRENCY MEDIUM TERM NOTE PROGRAMME S$500,000,000 2.35% P.A. FIXED RATE NOTES (SERIES NO. 074)
INTEREST FOR PERIOD MAY 25, 2023 UP TO BUT NOT INCLUDING NOVEMBER 25, 2023
(PAYABLE ON NOVEMBER 27, 2023)

INTEREST PERIOD = MAY 25, 2023 UP TO BUT NOT INCLUDING NOVEMBER 25, 2023

NO. OF DAYS = 184 DAYS

INTEREST RATE = 2.35% P.A.

CALCULATION OF INTEREST = ACTUAL OVER ACTUAL (ICMA)

INTEREST PAYMENT DATE = NOVEMBER 27, 2023

BOOK CLOSURE DATE = NOVEMBER 20, 2023 AT 5 P.M

Event Dates

Coupon Period (both dates inclusive)
25/05/2023 TO 24/11/2023
Number of Days
184
Record Date and Time
20/11/2023 17:00:00
Ex Date
17/11/2023

Disbursement Details

Cash Payment Details
Taxable
No
Coupon Rate (%)
2.35
Pay Date
27/11/2023

Attachments

HDB Series 074 - 27Nov23.pdf
Total size =591K