Moratorium::Update on application for leave to convene meetings of creditors to approve a scheme of arrangement

Issuer & Securities

Issuer/ Manager
HIAP SENG ENGINEERING LTD
Securities
HIAP SENG ENGINEERING LTD - SG1G69871497 - 510
Stapled Security
No

Announcement Details

Announcement Title
Moratorium
Date &Time of Broadcast
29-Jun-2022 17:04:51
Status
New
Announcement Sub Title
Update on application for leave to convene meetings of creditors to approve a scheme of arrangement
Announcement Reference
SG220629OTHRTF59
Submitted By (Co./ Ind. Name)
Tan Hak Jin
Designation
Joint Company Secretary
Description (Please provide a detailed description of the event in the box below-Refer to the Online help for the format)
Please see the attachment.

Attachments

HSEL_Announcement_Scheme_Application_Outcome.pdf
Total size =554K