General Announcement::Notice Regarding Capital Investment for High-Performance IC Package Substrates

Issuer & Securities

Announcement Title: General Announcement
Date &Time of Broadcast: 03-Feb-2026 15:27:56
Status: New
Announcement Sub Title: Notice Regarding Capital Investment for High-Performance IC Package Substrates
Announcement Reference: SG260203OTHR7NHE
Submitted By (Co./ Ind. Name): Katsutoshi Nishimura
Designation: Finance Division Manager, Strategic Corporate Planning Operation
Effective Date and Time of the event: 03/02/2026 15:30:00
Description (Please provide a detailed description of the event in the box below): Notice Regarding Capital Investment for High-Performance IC Package Substrates (Acquisition of Fixed Assets)
IBIDEN CO., LTD. (hereinafter the Company ) hereby announces that the Board of Directors, at a meeting held today,resolved to approve a capital investment plan for its electronics business, amounting to approximately 500 billion yen over the three-year period from fiscal year 2026 to fiscal year 2028, with the aim of achieving the fiscal year 2030 targets disclosed in May last year. As the first phase of this plan, the Company hereby announces our resolution to implement
additional capital investment, primarily for the existing Gama Plant (Cell6), for the purpose of expanding the production capacity of high-performance IC package substrates, mainly for high performance servers.

Total size =83K