General Announcement::PLACING AND SUBSCRIPTION OF SHARES; PROPOSED ISSUE OF US$95 MILLION ZERO COUPON CONVERTIBLE BONDS

Issuer & Securities

Issuer/ Manager
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
Securities
SEMICONDUCTOR US$200M CB181107 - XS0987076899 - 2J6B

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
10-Jun-2014 16:57:42
Status
New
Announcement Sub Title
PLACING AND SUBSCRIPTION OF SHARES; PROPOSED ISSUE OF US$95 MILLION ZERO COUPON CONVERTIBLE BONDS
Announcement Reference
SG140610OTHRHTRB
Submitted By (Co./ Ind. Name)
Issuer Services
Designation
SGX-ST
Description (Please provide a detailed description of the event in the box below)
On 4 June 2014, Datang, the substantial shareholder of the Company, entered into the Placing and Subscription Agreement with the Joint Placing Agents and the Company pursuant to which Datang agreed to appoint the Joint Placing Agents, and each of the Joint Placing Agents has agreed, severally and not jointly, to act as agent for Datang, to purchase or procure purchasers to purchase 2,590,000,000 Sale Shares held by Datang at the price of HK$0.60 per Sale Share. Following completion of the Placing, Datang will subscribe for 2,590,000,000 Subscription Shares at the price of HK$0.60 per Subscription Share. The Subscription Shares will be allotted and issued pursuant to the 2013 General Mandate and will rank pari passu in all respects with the Shares. The issue of the Subscription Shares is not subject to the approval of the Shareholders.

Attachments

Placing of Existing Shares and Subscription of New Shares_e.pdf
Placing of Existing Shares and Subscription of New Shares_c.pdf
Total size =1031K

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