General Announcement::COMPLETION OF PLACING OF EXISTING SHARES AND SUBSCRIPTION OF NEW SHARES UNDER 2013 GENERAL MANDATE

Issuer & Securities

Issuer/ Manager
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
Securities
SEMICONDUCTOR US$200M CB181107 - XS0987076899 - 2J6B

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
13-Jun-2014 18:11:59
Status
New
Announcement Sub Title
COMPLETION OF PLACING OF EXISTING SHARES AND SUBSCRIPTION OF NEW SHARES UNDER 2013 GENERAL MANDATE
Announcement Reference
SG140613OTHR1KW4
Submitted By (Co./ Ind. Name)
Issuer Services
Designation
SGX-ST
Description (Please provide a detailed description of the event in the box below)
The Company announces that the completion of the Placing took place on 9 June 2014 and the completion of the Subscription took place on 12 June 2014. Pursuant to the terms and conditions of the Placing and Subscription Agreement, (i) a total of 2,590,000,000 Sale Shares were successfully placed by the Joint Placing Agents to not fewer than six (6) independent Placees, who are third parties independent of and not connected with the Company and its connected persons, at the placing price of HK$0.60 per Sale Share and (ii) the Company allotted and issued 2,590,000,000 Subscription Shares, representing approximately 7.44% of the issued share capital of the Company as enlarged by the issue of the 2,590,000,000 new Shares, to the Vendor at the price of HK$0.60 per Subscription Share.

Attachments

e_A140682.pdf
c_A140682.pdf
Total size =635K

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