General Announcement::AWARD OF S$232.8 MILLION CONTRACT BY HOUSING AND DEVELOPMENT BOARD
Issuer & Securities
CHIP ENG SENG CORPORATION LTD.
CHIP ENG SENG CORPORATION LTD - SG1H36875612 - C29
Date &Time of Broadcast
Announcement Sub Title
AWARD OF S$232.8 MILLION CONTRACT BY HOUSING AND DEVELOPMENT BOARD
Submitted By (Co./ Ind. Name)
Chia Lee Meng Raymond
Executive Deputy Chairman and Group Chief Executive Officer
Description (Please provide a detailed description of the event in the box below)
AWARD OF S$232.8 MILLION CONTRACT BY HOURSING AND DEVELOPMENT BOARD FOR BUILDING WORKS AT WOODLANDS NEIGHBOURHOOD 1 CONTRACT 26 AND CONTRACT 27
Please see attached.
Total size =161K