General Announcement::AWARD OF CONTRACT RELATING TO DESIGN & BUILD OF UPGRADING PROJECTS FOR G27A BY THE HDB
Issuer & Securities
CHIP ENG SENG CORPORATION LTD.
CHIP ENG SENG CORPORATION LTD - SG1H36875612 - C29
CHIPENGSENG S$125M4.9%N220519 - SG7BC0000007 - 6X7B
CHIPENGSENG S$120M4.75%N210614 - SG73C5000004 - 4F1B
Date &Time of Broadcast
Announcement Sub Title
AWARD OF CONTRACT RELATING TO DESIGN & BUILD OF UPGRADING PROJECTS FOR G27A BY THE HDB
Submitted By (Co./ Ind. Name)
Chia Lee Meng Raymond
Executive Director and Group Chief Executive Officer
Description (Please provide a detailed description of the event in the box below)
Please see attached.
Total size =15K