General Announcement::2018.3.Correction on the capital loans and breakdown information of the Company

Issuer & Securities

Issuer/ Manager
CHI MEI MATERIALS TECHNOLOGY CORPORATION
Securities
CHI MEI MATERIALS TECH GDR - US16935L1098 - CKW
Stapled Security
No

Announcement Details

Announcement Title
General Announcement
Date &Time of Broadcast
10-May-2018 18:48:23
Status
New
Announcement Sub Title
2018.3.Correction on the capital loans and breakdown information of the Company
Announcement Reference
SG180510OTHRIE52
Submitted By (Co./ Ind. Name)
WEI CHUNG, LIAN
Designation
Chief Financial Officer
Effective Date and Time of the event
10/05/2018 17:00:00
Description (Please provide a detailed description of the event in the box below)
Please see attachment

Attachments

2018.3.Correction on the capital loans and breakdown information of the Company.pdf
Total size =99K